大家好！无锡施罗森科技有限公司提供半导体领域4-12寸前端清洗相关二手设备、新设备、技术服务、零部件与化学品等。主要客户有SK hynix、CSMC、Intel等，其中代理销售新设备主要有：Single Wafer Cleaner、Hybrid System、In Situ Post Purge System、PECVD、Dry Etcher等。主要客户有SK hynix、CSMC等，详细资料请参考本公司网站产品信息内容。欢迎广大客户来电咨询。


代理新设备信息如下：
Single Wafer Cleaner

Model ：SI-308M
Wafer Size：300mm (200mm available)
Chamber Con：8 Ch, 4 Level (3+1 chemical), 5 Dispenser ; (3Chemical, DIW, IPA, N2, Nano), Exhaust Separation; (ACID, Alkali, Organic), Drain Separation ,each Chemical, Nozzle separation Damage minimize, Automatic exhaust change
Chemical：4chemicals; (Che-1, Che-2, Che-3, IPA), Special configuration; [Hot DIW(85c), Hot IPA (75c), Nano spray, Nano SC1, N2 Dry], All Chemical Recycle & Drain, Leaning free & water mark, free Dryer , Nano spray ,+ Nano – SC, Chemical recycle function, for CoC optimize
Special Dryer：Synchronizing Dryer, (hot temp. IPA + N2 scan), Additional Hot DIW Rinse
Confirmed water mark free & Leaning free in A” Company (30nm DRAM, 20nm Flash)
EFEM: 4 FOUP, 1 Index robot (5+5 Blade), 2 WTR, Throughput optimize, Chamber flexible
FA: OHT, AGV
SW: All PC control, After Service optimize
Throughput: > 300wph (80sec)
Dimension: 2520(W) x 4150(D) x 2850(H)

Wafer Scrubber
Model: SC-Series
Design Rule: < 30nm
FA: OHT, AGV Possible
Chamber #: 8ea, 2 Floor Type
Throughput: 480WPH (50sec) 8 Chamber
Robotics: Four FOUPs, One Index Robot, Two WTRs, Eight Buffers (Each LD/ULD)
Dimension: 2500(W)ⅹ3220(D)ⅹ2850(H)mm


产品名称：半导体新设备
产品手机链接：http://m.vooec.com/product_18072380.html
产品网站链接：http://www.vooec.com/cpshow_18072380/