CHO-BOND 592 is a highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics.

123/5000
CHO-BOND 592是一种高导电银填充环氧粘合剂，结合了金属和有机物的最佳性能。

CHO-BOND 592 is a highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics.

123/5000
CHO-BOND 592是一种高导电银填充环氧粘合剂，结合了金属和有机物的最佳性能。CHO-BOND 592 is a highly conductive silver-filled epoxy adhesive which combines the best properties of metals and organics.

123/5000
CHO-BOND 592是一种高导电银填充环氧粘合剂，结合了金属和有机物的最佳性能。
产品名称：CHO-BOND 592
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