EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic
and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has
proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also
available in a single component frozen syringe.
EPO-TEK®
H20E Advantages & Application Notes:
Processing info: It can be applied by many dispensing, stamping and screen printing techniques.
o Dispensing: compatible with pressure/time delivery, auger screws, fluid jetting and G27 needles, in a single-component
fashion.
o Screen Printing: best using >200 metal mesh, with polymer squeegee blade with 80D hardness.
o Stamping: small dots 6 mil in diameter can be realized.
Misc / Other notes
o Many technical papers written over 30-40 year lifetime.
o Over 1 trillion chips attached at a single company: no failures, Six Sigma and Certified Parts Supplier award winner.
o Versatility in curing techniques including box oven, SMT style tunnel oven, heater gun, hot plate, IR, convection, or inductor
coil
产品名称：EPO-TEK H20E
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